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HDI PCB
HDI PCB

High density interconnect(HDI) PCB, one of the fastest growing technologies in printed circuit boards, have higher circuitry density compared to universal circuit boards. We are committed to providing high quality and reliability HDI printed circuit board manufacturing service to customers with cheap price and quick turnkey.


HDI PCB China-1   HDI PCB China-2


HDI PCBs always contain laser & NC drilling blind vias, buried vias, stack vias, stager vias, skip vias, step vias, through holes, fine lines and spaces, sequential lamination, Via-in-Pad technology and often with microvias diameter not more than 6mil, and etc.


HDI PCB Manufacturing Capacities:

Item

Typical Value

Advanced Production

Layer Count

4-16 Layers

4-24 Layers

PCB Thickness

0.6-1.0mm

0.6-3.2mm

Buid Up Technology

I+N+I (i≥1)

Any layer innterconnected

Min. Laser Drilling Diamter

4mil (0.1mm)

3mil (0.075mm)

Laser Technology

CO2 Laser Machine

CO2 Laser Machine

Glass Transition (Tg)

140/150/170°C

140/150/170°C

Hole Copper

12-18μm

12-18μm

Impedance Control

+/-10%

+/-7%

Layer to Layer Registration

+/-3mil

+/-2mil

Solder Mask Registration

+/-2mil

+/-1mil

Min. Trace Width/Spacing

3/3mil

2.0/2.0mil

Min. Annular Ring

2.5mil

2.5mil

Min. NC Drilling Diameter

8mil (0.2mm)

6mil(0.15mm)

Min. Micro Via

4.0mil

3.0mil

Min. Build-up Dielectric Thickness

3.0mil

2.0mil

Max. Micro Via Pad

12mil

10mil

Max. Micro Via Aspect Ratio

0.8:1

1:1


HDI Boards Design Rules:

Item

Capacity

Advanced

Base Copper

9-18μm

3-18μm

Min. Trace Width for Outer Layer

3mil

2.5mil

Min. Trace Spacing for Outer Layer

3mil

3mil

Min. Trace Width for Inner Layer

3mil

3mil

Min. Trace Spacing for Inner Layer

3mil

3mil

Microvia Size

4mil (0.1mm)

3mil(0.075mm)

Min. Microvia Landing Pad

Microvia Size + 8mil(0.2mm)

Microvia Size + 6mil(0.15mm)

Min. Microvia Pad

Microvia Size + 8mil(0.2mm)

Microvia Size + 8mil(0.2mm)

Min. NC Drilling Diameter

8mil(0.2mm)

6mil(0.15mm)

Min. Pad Size

Drilling Size + 12mil(0.3mm)

Drilling Size + 10mil (0.25mm)

Dielectric Thickness

2-4mil

2-5mil


Common used HDI PCB Stackups as below for reference:


HDI-1


totop