Date:

Tue, May 16 - Thu, May 18, 2017

Location:

 NürnbergMesse, Nuremberg, Germany

Description:

 SMT Hybrid Packaging - Europe`s leading event for System Integration in Micro Electronics -  presents the latest trends, developments and up-to-date solutions.

SMT Hybrid Packaging is the only event in Europe which takes a comprehensive view of System integration in microelectronics, from the initial idea and its development right through to the production of all technical processes during the manufacture of electronic assemblies.

Experience the diversity of Assembly and Interconnection Technologies

The exhibition and conference shows the complete spectrum on System Integration in Micro Electronics. This international meeting point in the field of electronic manufacturing offers the latest products, services and solutions - the complete market overview under one roof.

Technologies and Processes

Materials and Components

Manufacturing

Manufacturing equipment

Reliability and Test

Software and Systems

Service and Consulting

Url:

 www.smt-exhibition.com